Artist’s concept: Notional rendering of 3D heterogeneous integration (3DHI).
The Next-Generation Microelectronics Manufacturing program, known as NGMM, aims to unlock accessible prototyping for the microelectronics of tomorrow by establishing the first-ever national center for advancing U.S.-based 3D heterogeneous integration (3DHI).
Given the Agency’s expectation that future innovation hinges on the fusion of diverse materials, devices, and circuits through advanced packaging, 3DHI will be key to U.S. technological leadership. The foundational goal of NGMM: Establish a self-sustaining manufacturing center for R&D and pilot production of high performance 3DHI microelectronics.
https://www.darpa.mil/research/programs/next-generation-microelectronics?utm_source=dvids&utm_medium=referral&utm_campaign=ngmm
| Date Taken: | 12.02.2025 |
| Date Posted: | 03.12.2026 11:09 |
| Photo ID: | 9562804 |
| VIRIN: | 251202-D-QD798-3026 |
| Resolution: | 3840x2160 |
| Size: | 1.85 MB |
| Location: | ARLINGTON, VIRGINIA, US |
| Web Views: | 9 |
| Downloads: | 2 |
This work, NGMM: Next-Generation Microelectronics Manufacturing [Image 4 of 4], by george wertz, identified by DVIDS, must comply with the restrictions shown on https://www.dvidshub.net/about/copyright.
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