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    AFRL, American Semiconductor create flexible system-on-chip for ‘internet-of-things’

    AFRL, American Semiconductor create flexible system-on-chip for ‘internet-of-things’

    WRIGHT-PATTERSON AIR FORCE BASE, UNITED STATES

    12.21.2017

    Courtesy Photo

    Air Force Research Laboratory

    WRIGHT-PATTERSON AIR FORCE BASE, Ohio – A collaboration between the Air Force Research Laboratory and American Semiconductor has produced a flexible silicon-on-polymer chip with more than 7,000 times the memory capability of any current flexible integrated circuit on the market today. The manufacturing takes advantage of flexible hybrid electronics, integrating traditional manufacturing techniques with 3D electronic printing to create thin, flexible semiconductors that can augment efforts in wearable technology, asset monitoring, logistics and more. (U.S. Air Force courtesy photo)

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    IMAGE INFO

    Date Taken: 12.21.2017
    Date Posted: 12.21.2017 14:55
    Photo ID: 4046791
    VIRIN: 171221-F-ZS999-001
    Resolution: 3008x1692
    Size: 1.87 MB
    Location: WRIGHT-PATTERSON AIR FORCE BASE, US

    Web Views: 160
    Downloads: 21

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