WEBVTT

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From the palm of your hand to the

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frontiers of defense , microelectronics

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power our world . But the industry is

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at a critical inflection point . For

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decades , innovation has focused on

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squeezing more transistors onto silicon

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chips , but the demands of emerging

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technologies are pushing this approach

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to its breaking point . Fabrication

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costs are skyrocketing , and we're

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hitting the physical limits of

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miniaturization . The future lies in a

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new dimension , 3D heterogeneous

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integration or 3D HI . 3D

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HI will revolutionize microelectronics

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by vertically stacking and

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interconnecting diverse components and

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materials , creating high performance

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systems that surpass traditional 2D

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technology . This innovation allows us

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to move beyond the limitations of

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silicon , integrating new materials to

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achieve capabilities essential for both

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Department of Defense and commercial

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applications . To spearhead this

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revolution , DARPA created the Next

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Generation microelectronics

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manufacturing Program , NGMM . DARPA is

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partnering with the University of Texas

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at Austin and it's Texas Institute for

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Electronics Research Center to

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establish the Ty NGMM Center in Austin ,

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Texas . This open access 3DHI

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manufacturing center will foster a

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vibrant ecosystem of innovators from

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industry giants to agile startups all

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working together to push the boundaries

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of microelectronics manufacturing .

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This ecosystem will drive disruptive

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innovation and ensure access to cutting

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edge technology for national security

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and economic competitiveness . 3DHI

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will be the engine of tomorrow's

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breakthroughs , driving innovation

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across industries and ensuring US

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leadership on the global technology

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stage . Join us in building a future

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with NGMM .